3M™ UV-Curable Adhesive LC-3200

3M™ UV-Curable Adhesive LC-3200 is ideal for the temporary bonding and debonding process (TBDB) for silicon wafers to support glass carriers during semiconductor processing. The adhesive is cured by UV light, reducing the need for heat and helping streamline semiconductor TBDB process flows. This UV-curable adhesive is used as part of the 3M™ Wafer Support System.

3M™ UV-Curable Adhesive LC-3200

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